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Board ID 1.0 Datasheet
Fig. 5.9 I2C Bus Interface
5.9.
Reflow Soldering Conditions
Reflowing must be performed under following condition:
Condition
Reflowing time (230 - 260°C)
Maximum temperature
260°C
Reflowing temperature
Maximum Reflowing Count
230°C
3 times
30 to 50 seconds
5.10. Storage and Handling
The device must be kept within the following condition after opening dry packing:
Condition
Note
Storage Temperature
Storage Humidity
5°C – 30°C
60% RH or less
Note 1:
Note 2:
It is recommended to complete the final reflow soldering process within 168 hours after
opening the dry packing.
Do not bake the device under any circumstance or the device may be permanently
damaged.
March 2010
Page 10
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